TurnKey Lender to Host a Joined Exhibition with Hewlett Packard at the FinTech Festival in Singapore
TurnKey Lender, a leading software provider for credit scoring, decision automation, and loan management, will exhibit together with Hewlett Packard at the 2018 Singapore FinTech Festival.
The FinTech Festival 2018 will take place in Singapore on November 12-16 and will feature multiple fintech Conferences & Exhibitions, AI in Finance Summit, Global FinTech Hackcelerator Demo Day, Innovation Lab Crawl, FinTech Awards, Workshops, and, of course, an expanded Investor Summit including “FinTech Deal Day,” “Meet ASEAN’s Talent” and “Champions (MATCH)”, and many others.
One of the highlights will be TurnKey Lender’s joined exhibition with Hewlett Packard and both companies cordially invite all guests and participants in the Fintech Festival to visit TurnKey Lender in booth 3G29.
The collaboration with Hewlett Packard is designed to offer improved lending solutions based on HPE ProLiant for Microsoft Azure stack, a hybrid cloud platform. “With HPE ProLiant for Microsoft Azure Stack, [lenders] are able to process large amounts of data with little to no latency,” commented Kong Hoe Chan, Solution Sales General Manager at Hewlett Packard Enterprise’s Asia Pacific hub. To book a face-to-face consultation, contact the TurnKey Lender team.
