TurnKey Lender to Host a Joined Exhibition with Hewlett Packard at the FinTech Festival in Singapore

TurnKey Lender, a leading software provider for credit scoring, decision automation, and loan management, will exhibit together with Hewlett Packard at the 2018 Singapore FinTech Festival.

The FinTech Festival 2018 will take place in Singapore on November 12-16 and will feature multiple fintech Conferences & Exhibitions, AI in Finance Summit, Global FinTech Hackcelerator Demo Day, Innovation Lab Crawl, FinTech Awards, Workshops, and, of course, an expanded Investor Summit including “FinTech Deal Day,” “Meet ASEAN’s Talent” and “Champions (MATCH)”, and many others.

One of the highlights will be TurnKey Lender’s joined exhibition with Hewlett Packard and both companies cordially invite all guests and participants in the Fintech Festival to visit TurnKey Lender in booth 3G29.

The collaboration with Hewlett Packard is designed to offer improved lending solutions based on HPE ProLiant for Microsoft Azure stack, a hybrid cloud platform. “With HPE ProLiant for Microsoft Azure Stack, [lenders] are able to process large amounts of data with little to no latency,” commented Kong Hoe Chan, Solution Sales General Manager at Hewlett Packard Enterprise’s Asia Pacific hub. To book a face-to-face consultation, contact the TurnKey Lender team.

About TurnKey Lender

TurnKey Lender is a global leader in credit scoring, decision automation, and loan management. TurnKey Lender's multiple award-winning SaaS platform is an intelligent end-to-end solution for complete automation of lending operations conducted by both non-bank lenders and banks. The solution supports all stages of a loan life cycle – from application processing and automated decision making to collections and reporting. The system can be easily integrated with any internal and external data sources and services for automatic data retrieval and processing.

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